India Semiconductor Mission

The Union Cabinet has approved four new semiconductor assembly and testing plants. These plants are part of the broader India Semiconductor Mission aimed at enhancing chip manufacturing capacity in India.

Plant Locations and Details

• Two plants in Odisha:
  • SiCSem Pvt Ltd will establish an ATMP facility for silicon carbide-based diodes and MOSFETs with an expected capacity of 96 million chips per year.
  • 3D Glass Solutions Inc. is setting up another ATMP plant with investments from Intel, Lockheed Martin, etc., with a capacity of 50 million chips a year.
• One plant in Andhra Pradesh:
  • Advanced System in Package Technologies (ASIP) will establish a semiconductor manufacturing unit through a technology partnership with APACT Co. Ltd., South Korea. The unit's capacity is 96 million units annually, targeting products like mobile phones, set-top boxes, and automotive electronics.
• One plant in Punjab:
  • Continental Device (CDIL) will expand a discrete semiconductor manufacturing facility at Mohali to produce high-power devices such as MOSFETs, IGBTs, and Schottky Bypass Diodes with an annual capacity of 158.38 million units.

Strategic Significance

• These new locations diversify chip manufacturing beyond Gujarat, where four of the 10 plants were approved earlier. 
• Previously, the government attracted six chip plants under the India Semiconductor Mission.

Future Plans

In August 2024, a $15 billion blueprint for the second phase of the India Semiconductor Mission was reported, focusing on capital support for raw materials and gases for chip manufacturing. The first made-in-India chip is expected by the end of this year.