Key Targets Include: 

• Build a resilient USD 120–150 billion semiconductor value chain by 2035.
• Capture 10–13% of the global semiconductor market, emerging as a top-3 destination for advanced packaging and OSAT (Outsourced Semiconductor Assembly and Test).
• Achieve 15–25% chip self-sufficiency by 2030, scaling to 35–50% by 2035.
• Attain 55–70% value self-sufficiency for every chip consumed domestically by 2035.

Roadmap: 5 Strategic Pillars

• Pioneering (R&D and Design IP): Building sovereign capabilities in frontier research and chip design, with a target to create over 100 advanced semiconductor IPs by 2035.
• Policy and Investment: 
  • Mobilizing an estimated USD 135–180 billion in long-term growth capital.
  • Creation of an autonomous ‘National Semiconductor Nodal Agency’ with a full-stack incentive regime, offering predictable, long-term policy visibility and demand-creation mandates.
• Production: Strategically focusing on areas of structural advantage (such as defense, aerospace), specifically targeting advanced packaging, mature and compound wafer fabrication (28–65 nm), and critical materials.
• People: Developing a comprehensive "National Semiconductor Talent Pyramid" to train the workforce at all levels, from fab-ready cleanroom technicians to advanced system-level solution architects.
• Partnerships: Establishing outcome-driven alliances with trusted nations (such as the US, Japan, and the EU) and global industries to secure critical mineral supply chains, integrate into global R&D networks, and accelerate technology transfer.