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Chip Mission 2.0 to Prioritise Silicon Carbide Wafer Making | Current Affairs | Vision IAS

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Chip Mission 2.0 to Prioritise Silicon Carbide Wafer Making

2 min read

India Semiconductor Mission (ISM) 2.0

The government is prioritizing silicon carbide (SiC)-based wafer manufacturing under the second version of the India Semiconductor Mission (ISM).

Strategic Priority

  • The electronics and information technology ministry is finalizing the contours of ISM 2.0 with a focus on SiC wafers.
  • SiC wafers are prioritized due to their operation at higher voltages, temperatures, and frequencies.

Background

  • The first phase of ISM had a financial outlay of ₹76,000 crore, with 10 projects approved so far.
  • Funds from the first phase are almost exhausted.

Applications of SiC Wafers

  • Next-generation applications in telecom, electric vehicles, defense, aerospace, and industrial sectors.
  • Significant role in power electronics, which involves energy-efficient conversion and control of electric power using solid-state semiconductor devices.
  • Key applications include industrial motor drives, renewable energy systems, and low-power devices like laptops and mobile phones.

Current Developments

  • First fabrication unit for SiC wafers approved in Chennai, in collaboration with Scotland-based Clas-SiC Wafer Fab.
  • Facility to be set up in Bhubaneswar with an investment of ₹2,066 crore, and an annual capacity of 60,000 wafers.
  • Tata Group's ₹91,000 crore facility in Gujarat's Dholera aims to build silicon wafers.

Challenges and Industry Requests

  • Domestic semiconductor firms seek enhanced government support for establishing SiC manufacturing in India.
  • Example: Zoho Group-owned Silectric Semiconductor postponed its plans for an SiC campus in Karnataka, citing the need for government backing.
  • Tags :
  • India Semiconductor Mission
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